2 process
2.1 vacuum evaporation coating process: vacuum coating process for evaporation of coating materials.
2.1.1 simultaneous evaporation of the simultaneous ousevaporation: vacuum evaporation of all kinds of evaporator with a number of evaporators on the substrate.
2.1.2 evaporation evaporation evaporationfieldevaporation: field at the same time evaporation materials to the substrate by evaporation on the evaporation of vacuum evaporation (this process applied in the large area of evaporation in order to obtain the ideal film thickness distribution).
2.1.3 reactive vacuum evaporation reactivevacuumevaporation: with gas reaction to obtain the ideal chemical composition of membrane material of vacuum evaporation.
2.1.4 reactivity of evaporator vacuum evaporation reactivevacuumevaporationinevaporator: reaction with all kinds of evaporation materials in the evaporator, and obtain the ideal chemical composition of membrane material of vacuum evaporation.
2.1.5 direct heating evaporation directheatingthe heat necessary to evaporate the evaporative material is the evaporation of the evaporating material (in the crucible or not in the crucible) itself.
2.1.6 induction heating evaporation inducedheatingevaporation: evaporation materials through induction eddy current heating evaporation.
2.1.7 electron beam vaporization electronic beamexplosion: evaporation of evaporation materials heated by electron bombardment.
2.1.8 laser beam evaporates laserbeambles: the evaporation of evaporation material is heated through a laser beam.
2.1.9 indirect heating evaporation indirectheatingevaporation: in heating device (such as boat shape evaporator, crucible, filament, the heating plate, heating rods, spiral coil, etc.) needed to make evaporation materials obtained in the heat conduction of heat or thermal radiation and by transfer to the evaporation of the evaporation materials.
2.1.10 flash flashevaportion: will a tiny amount of evaporation materials continuously do instantaneous evaporation.
2.2 vacuum sputtering vacuumsputtering: in a vacuum, the inert gas ion bombards atoms (molecules) or groups of atoms from the surface of the target.
2.2.1 reactive vacuum sputtering reactivevacuumsputtering: with gas reaction to obtain the ideal chemical composition of the membrane material of vacuum sputtering.
2.2.2 bias sputtering biassputtering: in the sputtering process, the bias is applied to the substrate and the sputtering of the membrane layer.
2.2.3 dc sputtering directcurrentdiodesputtering 2: through the dc voltage between two electrodes, the gas and the target as a self sustaining discharge cathode sputtering.
2.2.4 asymmetrical ac sputtering asymmtricalternatecurrentsputtering: by asymmetric ac voltage between two electrodes, the gas and the target as a self sustaining discharge absorption with fusion of ion current electrode.
2.2.5 high frequency diode sputtering highfrequencydiodesputtering: by high frequency voltage to obtain the high frequency discharge between two electrodes and obtain the negative potential sputtering target.
2.2.6 hot cathode dc sputtering (three pole sputtering) hotcathodedirectcurrentsputtering: by hot cathode and anode gas discharge, a self sustaining ions, produced by gas discharge by between the anode and the cathode (target) to accelerate in the applied voltage and bombarding the sputtering target.
2.2.7 high frequency hot cathode sputtering (three pole sputtering) hotcathodehighfrequencysputtering: by hot cathode and anode for non self sustaining gas discharge, gas discharge ion, under the effect of negative potential on the surface of the target acceleration and bombarding the sputtering target.
2.2.8 ion beam sputtering ionbeamsputtering: ion beam obtained from a special ion source makes the target sputtering.
2.2.9 glow discharge cleaning glowdischargecleaning: using the principle of glow discharge to make the substrate and the surface of the film undergo the cleaning process of gas discharge bombardment.
2.3 physical vapor deposition; PVDphysicalvapordeposition: under the vacuum state, coating material evaporation or sputtering physical methods, such as gasification, the deposit to the substrate of a method of preparing membrane layer.
2.4 chemical vapor deposition; CVDchemicalvapordeposition: the ratio of a certain chemical reaction gas, in particular the activation conditions (usually a certain high temperature), by gas phase chemical reactions generated new membrane material deposition to a method of preparing membrane layer on the substrate.
2.5 magnetron sputtering magnetronsputtering: with the aid of a target is formed on the surface of the orthogonal electromagnetic field, the secondary electron bound in a particular area target surface, to enhance the ionization efficiency, increase the ion density and energy, and therefore can be in low voltage, high electric flow to achieve a high sputtering rate.
2.6 plasma chemical vapor deposition; PCVDplasmachemistryvapordeposition: promote the gas phase by discharge plasma produced by the chemical reaction, under low temperature, a method of preparing membrane layer on substrate.
2.7 hollow cathode ion plating HCDhollowcathodedischargedeposition: with hollow cathode emission electron beam, make the crucible in evaporation coating materials and ionization, under the effect of the substrate negative bias, the ions with large energy, is deposited on the substrate surface of a coating method.
2.8 arc ion plating arcdischargedeposition: by the coating material as the target, by means of initiating device, make the target surface produces arc discharge, coating material under the effect of arc, the produced no molten pool evaporation and deposition on the substrate of a coating method.
3 special parts
3.1 coating chamber: components of the actual coating process in vacuum coating equipment
3.2 evaporator unit evaporatordevice: vacuum coating equipment included in the evaporator and all needed to work for the device (such as electricity supply, feeding and cooling device, etc.) of parts.
Evaporator: 3.3 evaporator evaporation directly in them for evaporation device, such as the boat shape evaporator, crucible, filament, the heating plate, heating rods, spiral coil and so on, also includes evaporation material itself when necessary.
3.4 direct heating evaporator evaporatorbydirectheat: evaporation materials themselves are heating evaporator.
3.5 indirect heating evaporator evaporatorbyindirectheat: evaporation materials by heat transfer or thermal radiation heating of the evaporator.
3.6 evaporation evaporationfield: by several order of evaporator heating evaporation same material field.
3.7 sputteringdevice: components of a vacuum sputtering device, including the necessary auxiliary devices (such as power supply devices, gas import devices, etc.) of the target and sputtering.
3.8 target target: the surface of the particle bombardment. The target in this standard is the electrode made up of sputtering material in the sputter device.
3.9 baffle shutter: a device used to limit the coating on time and/or space to achieve a certain film thickness distribution. The baffle can be fixed or movable.
3.10 time control panel timingshutter: can be used to limit the coating in time, so from the beginning of the coating to the end, the device can be carried out at the specified time.
Mask mask: a device used to cover a segment of a substrate and to limit the coating in space.
3.12 substrateholder: a device that can hold a substrate directly, such as a clamping device, a frame and a similar clamping device.
3.13 clamping device clamp device: a device used in the coating equipment or without a substrate supporting a substrate or a few substrate, such as chuck, drum, spherical clamping, basket, etc. Clamping device can be fixed or movable (rotating frame, planetary gear train, etc.).
Reversing device reversingdevice 3.14: in the vacuum coating equipment, do not open the equipment can put substrate, experiment of glass or mask in ideal location on the device (substrate commutator, test glass commutator, mask commutator).
3.15 substrateheatingdevice: in a vacuum coating device, a substrate or substrate is heated to achieve an ideal temperature.
3.16 substrate cooling device substratecoldingdevice: in a vacuum coating device, the device that enables a substrate or several substrate to reach an ideal temperature by cooling.